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SLLS047L ? FEBRUARY 1989 ? REVISED MARCH 2004  
MAX232 . . . D, DW, N, OR NS PACKAGE  
MAX232I . . . D, DW, OR N PACKAGE  
(TOP VIEW)  
D
D
D
D
D
D
D
Meets or Exceeds TIA/EIA-232-F and ITU  
Recommendation V.28  
Operates From a Single 5-V Power Supply  
With 1.0-mF Charge-Pump Capacitors  
V
C1+  
1
2
3
4
5
6
7
8
16  
15  
14  
CC  
GND  
V
Operates Up To 120 kbit/s  
Two Drivers and Two Receivers  
30-V Input Levels  
S+  
T1OUT  
C1?  
C2+  
C2?  
13 R1IN  
12 R1OUT  
Low Supply Current . . . 8 mA Typical  
11  
10  
9
T1IN  
V
S?  
ESD Protection Exceeds JESD 22  
? 2000-V Human-Body Model (A114-A)  
T2IN  
T2OUT  
R2IN  
R2OUT  
D
Upgrade With Improved ESD (15-kV HBM)  
and 0.1-mF Charge-Pump Capacitors is  
Available With the MAX202  
D
Applications  
? TIA/EIA-232-F, Battery-Powered Systems,  
Terminals, Modems, and Computers  
description/ordering information  
The MAX232 is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/EIA-232-F  
voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels.  
These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept 30-V inputs.  
Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels. The driver, receiver, and  
voltage-generator functions are available as cells in the Texas Instruments LinASIC? library.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
?
PACKAGE  
T
A
PDIP (N)  
SOIC (D)  
Tube of 25  
Tube of 40  
Reel of 2500  
Tube of 40  
Reel of 2000  
Reel of 2000  
Tube of 25  
Tube of 40  
Reel of 2500  
Tube of 40  
Reel of 2000  
MAX232N  
MAX232N  
MAX232D  
MAX232  
MAX232DR  
MAX232DW  
MAX232DWR  
MAX232NSR  
MAX232IN  
0°C to 70°C  
SOIC (DW)  
MAX232  
SOP (NS)  
PDIP (N)  
MAX232  
MAX232IN  
MAX232ID  
SOIC (D)  
MAX232I  
MAX232I  
?40°C to 85°C  
MAX232IDR  
MAX232IDW  
MAX232IDWR  
SOIC (DW)  
?
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design  
guidelines are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
LinASIC is a trademark of Texas Instruments.  
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Copyright ? 2004, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 ? DALLAS, TEXAS 75265  
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SLLS047L ? FEBRUARY 1989 ? REVISED MARCH 2004  
Function Tables  
EACH DRIVER  
INPUT  
TIN  
OUTPUT  
TOUT  
L
H
L
H
H = high level, L = low  
level  
EACH RECEIVER  
INPUT  
RIN  
OUTPUT  
ROUT  
L
H
L
H
H = high level, L = low  
level  
logic diagram (positive logic)  
11  
10  
12  
9
14  
7
T1IN  
T1OUT  
T2OUT  
R1IN  
T2IN  
R1OUT  
R2OUT  
13  
8
R2IN  
2
POST OFFICE BOX 655303 ? DALLAS, TEXAS 75265  
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??? ? ?? ??? ? ? ??? ?? ???? ? ?? ? ?? ? ?  
?
?
SLLS047L ? FEBRUARY 1989 ? REVISED MARCH 2004  
?
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Input supply voltage range, V  
Positive output supply voltage range, V  
Negative output supply voltage range, V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ?0.3 V to 6 V  
CC  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ?0.3 V to ?15 V  
? 0.3 V to 15 V  
S+  
S?  
CC  
Input voltage range, V : Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ?0.3 V to V  
+ 0.3 V  
I
CC  
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V  
Output voltage range, V : T1OUT, T2OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V ? 0.3 V to V + 0.3 V  
O
S?  
S+  
CC  
R1OUT, R2OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ?0.3 V to V  
+ 0.3 V  
Short-circuit duration: T1OUT, T2OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited  
Package thermal impedance, θ (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W  
JA  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W  
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
J
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ?65°C to 150°C  
stg  
?
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltages are with respect to network GND.  
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable  
J
JA  
A
ambient temperature is P = (T (max) ? T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
A
JA  
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions  
MIN NOM  
MAX  
UNIT  
V
V
V
Supply voltage  
4.5  
2
5
5.5  
V
V
V
V
CC  
IH  
IL  
High-level input voltage (T1IN,T2IN)  
Low-level input voltage (T1IN, T2IN)  
Receiver input voltage  
0.8  
30  
70  
85  
R1IN, R2IN  
MAX232  
MAX232I  
0
T
A
Operating free-air temperature  
°C  
?40  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted) (see Note 4 and Figure 4)  
?
PARAMETER  
TEST CONDITIONS  
= 5.5 V, All outputs open,  
MIN TYP  
MAX  
UNIT  
V
T
A
CC  
= 25°C  
I
Supply current  
8
10  
mA  
CC  
?
All typical values are at V  
CC  
= 5 V and T = 25°C.  
A
NOTE 4: Test conditions are C1?C4 = 1 μF at V  
= 5 V 0.5 V.  
CC  
3
POST OFFICE BOX 655303 ? DALLAS, TEXAS 75265  
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? ??? ?? ? ?? ?? ? ?? ? ? ?? ?? ? ?? ? ?? ? ?  
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?
SLLS047L ? FEBRUARY 1989 ? REVISED MARCH 2004  
DRIVER SECTION  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature range (see Note 4)  
?
PARAMETER  
High-level output voltage  
TEST CONDITIONS  
= 3 k? to GND  
MIN TYP  
MAX  
UNIT  
V
V
V
T1OUT, T2OUT  
T1OUT, T2OUT  
T1OUT, T2OUT  
T1OUT, T2OUT  
T1IN, T2IN  
R
R
5
7
OH  
L
?
= 3 k? to GND  
?7  
10  
?5  
V
Low-level output voltage  
OL  
L
r
Output resistance  
V
V
= V = 0,  
S?  
V
V
=
2 V  
300  
?
o
S+  
O
§
I
I
Short-circuit output current  
Short-circuit input current  
= 5.5 V,  
= 0  
mA  
μA  
OS  
IS  
CC  
O
V = 0  
200  
I
?
?
All typical values are at V  
CC  
= 5 V, T = 25°C.  
A
The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage  
levels only.  
§
Not more than one output should be shorted at a time.  
NOTE 4: Test conditions are C1?C4 = 1 μF at V  
CC  
= 5 V 0.5 V.  
switching characteristics, V  
= 5 V, T = 25°C (see Note 4)  
A
CC  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
R
= 3 k? to 7 k?,  
L
SR  
Driver slew rate  
30  
V/μs  
See Figure 2  
SR(t)  
Driver transition region slew rate  
Data rate  
See Figure 3  
3
V/μs  
One TOUT switching  
120  
kbit/s  
NOTE 4: Test conditions are C1?C4 = 1 μF at V  
CC  
= 5 V 0.5 V.  
RECEIVER SECTION  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature range (see Note 4)  
?
PARAMETER  
High-level output voltage  
TEST CONDITIONS  
= ?1 mA  
MIN TYP  
MAX  
UNIT  
V
V
V
R1OUT, R2OUT  
R1OUT, R2OUT  
I
I
3.5  
OH  
OH  
?
= 3.2 mA  
0.4  
2.4  
V
Low-level output voltage  
OL  
OL  
Receiver positive-going input  
threshold voltage  
V
IT+  
R1IN, R2IN  
R1IN, R2IN  
V
V
= 5 V,  
= 5 V,  
T
A
= 25°C  
= 25°C  
1.7  
1.2  
V
V
CC  
Receiver negative-going input  
threshold voltage  
V
V
T
A
0.8  
IT?  
CC  
Input hysteresis voltage  
Receiver input resistance  
R1IN, R2IN  
R1IN, R2IN  
V
V
= 5 V  
= 5,  
0.2  
3
0.5  
5
1
7
V
hys  
CC  
r
T
A
= 25°C  
k?  
i
CC  
?
?
All typical values are at V  
CC  
= 5 V, T = 25°C.  
A
The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage  
levels only.  
NOTE 4: Test conditions are C1?C4 = 1 μF at V  
= 5 V 0.5 V.  
CC  
switching characteristics, V  
= 5 V, T = 25°C (see Note 4 and Figure 1)  
CC  
A
PARAMETER  
TYP  
500  
500  
UNIT  
ns  
t
t
Receiver propagation delay time, low- to high-level output  
Receiver propagation delay time, high- to low-level output  
PLH(R)  
ns  
PHL(R)  
NOTE 4: Test conditions are C1?C4 = 1 μF at V  
= 5 V 0.5 V.  
CC  
4
POST OFFICE BOX 655303 ? DALLAS, TEXAS 75265  
? ??? ? ? ? ? ?? ? ?? ?  
??? ? ?? ??? ? ? ??? ?? ???? ? ?? ? ?? ? ?  
?
?
SLLS047L ? FEBRUARY 1989 ? REVISED MARCH 2004  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
R
= 1.3 k?  
L
R1OUT  
or  
R2OUT  
R1IN  
or  
R2IN  
See Note C  
Pulse  
Generator  
(see Note A)  
C
= 50 pF  
L
(see Note B)  
TEST CIRCUIT  
≤10 ns  
≤10 ns  
3 V  
0 V  
90%  
50%  
90%  
50%  
Input  
10%  
10%  
500 ns  
t
PLH  
t
PHL  
V
V
OH  
Output  
1.5 V  
1.5 V  
WAVEFORMS  
NOTES: A. The pulse generator has the following characteristics: Z = 50 ?, duty cycle ≤ 50%.  
OL  
O
B.  
C includes probe and jig capacitance.  
C. All diodes are 1N3064 or equivalent.  
L
Figure 1. Receiver Test Circuit and Waveforms for t  
and t  
Measurements  
PHL  
PLH  
5
POST OFFICE BOX 655303 ? DALLAS, TEXAS 75265  
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? ??? ?? ? ?? ?? ? ?? ? ? ?? ?? ? ?? ? ?? ? ?  
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SLLS047L ? FEBRUARY 1989 ? REVISED MARCH 2004  
PARAMETER MEASUREMENT INFORMATION  
T1IN or T2IN  
T1OUT or T2OUT  
Pulse  
EIA-232 Output  
Generator  
(see Note A)  
C
= 10 pF  
L
R
L
(see Note B)  
TEST CIRCUIT  
≤10 ns  
≤10 ns  
3 V  
0 V  
90%  
50%  
90%  
50%  
Input  
10%  
10%  
5 μs  
t
PLH  
90%  
t
PHL  
V
OH  
90%  
Output  
10%  
10%  
V
OL  
t
TLH  
)
t
THL  
0.8 (V  
– V  
)
0.8 (V  
– V  
OH  
t
OL  
OL  
t
OH  
SR +  
or  
TLH  
THL  
WAVEFORMS  
NOTES: A. The pulse generator has the following characteristics: Z = 50 ?, duty cycle ≤ 50%.  
O
B.  
C includes probe and jig capacitance.  
L
Figure 2. Driver Test Circuit and Waveforms for t  
and t  
Measurements (5-μs Input)  
PHL  
PLH  
Pulse  
Generator  
(see Note A)  
EIA-232 Output  
3 k?  
C
= 2.5 nF  
L
TEST CIRCUIT  
≤10 ns  
≤10 ns  
Input  
90%  
1.5 V  
90%  
1.5 V  
10%  
10%  
20 μs  
t
TLH  
t
THL  
3 V  
V
V
OH  
3 V  
Output  
?3 V  
6 V  
?3 V  
OL  
SR +  
t
or t  
THL  
TLH  
WAVEFORMS  
NOTE A: The pulse generator has the following characteristics: Z = 50 ?, duty cycle ≤ 50%.  
O
Figure 3. Test Circuit and Waveforms for t  
and t  
Measurements (20-μs Input)  
THL  
TLH  
6
POST OFFICE BOX 655303 ? DALLAS, TEXAS 75265  
? ??? ? ? ? ? ?? ? ?? ?  
??? ? ?? ??? ? ? ??? ?? ???? ? ?? ? ?? ? ?  
?
?
SLLS047L ? FEBRUARY 1989 ? REVISED MARCH 2004  
APPLICATION INFORMATION  
5 V  
+
?
C
=1μF  
BYPASS  
16  
?
C3  
1 μF  
V
CC  
1
3
4
5
2
C1+  
C1?  
C2+  
C2?  
8.5 V  
?8.5 V  
V
C1  
1 μF  
S+  
6
V
S?  
C4  
1 μF  
C2  
1 μF  
+
14  
11  
EIA-232 Output  
EIA-232 Output  
EIA-232 Input  
EIA-232 Input  
From CMOS or TTL  
To CMOS or TTL  
10  
12  
7
13  
8
9
0 V  
15  
GND  
?
C3 can be connected to V  
or GND.  
NOTES: A. Resistor values shown are nominal.  
CC  
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be  
connected as shown. In addition to the 1-μF capacitors shown, the MAX202 can operate with 0.1-μF capacitors.  
Figure 4. Typical Operating Circuit  
7
POST OFFICE BOX 655303 ? DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
MAX232D  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX232DE4  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX232DG4  
MAX232DR  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX232DRE4  
MAX232DRG4  
MAX232DW  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DW  
DW  
DW  
DW  
DW  
DW  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX232DWE4  
MAX232DWG4  
MAX232DWR  
MAX232DWRE4  
MAX232DWRG4  
MAX232ID  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX232IDE4  
MAX232IDG4  
MAX232IDR  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX232IDRE4  
MAX232IDRG4  
MAX232IDW  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DW  
DW  
DW  
DW  
DW  
DW  
N
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX232IDWE4  
MAX232IDWG4  
MAX232IDWR  
MAX232IDWRE4  
MAX232IDWRG4  
MAX232IN  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
Orderable Device  
MAX232INE4  
MAX232N  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
PDIP  
N
16  
16  
16  
16  
16  
16  
25  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
PDIP  
PDIP  
SO  
N
Pb-Free  
(RoHS)  
MAX232NE4  
N
Pb-Free  
(RoHS)  
MAX232NSR  
MAX232NSRE4  
MAX232NSRG4  
NS  
NS  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Jul-2011  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
MAX232DR  
MAX232DWR  
MAX232IDR  
MAX232IDWR  
MAX232NSR  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
16  
16  
16  
16  
16  
2500  
2000  
2500  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
16.4  
16.4  
6.5  
10.75 10.7  
6.5 10.3  
10.75 10.7  
8.2 10.5  
10.3  
2.1  
2.7  
2.1  
2.7  
2.5  
8.0  
12.0  
8.0  
16.0  
16.0  
16.0  
16.0  
16.0  
Q1  
Q1  
Q1  
Q1  
Q1  
DW  
D
DW  
NS  
12.0  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Jul-2011  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
MAX232DR  
MAX232DWR  
MAX232IDR  
MAX232IDWR  
MAX232NSR  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
16  
16  
16  
16  
16  
2500  
2000  
2500  
2000  
2000  
346.0  
346.0  
333.2  
346.0  
346.0  
346.0  
346.0  
345.9  
346.0  
346.0  
33.0  
33.0  
28.6  
33.0  
33.0  
DW  
D
DW  
NS  
Pack Materials-Page 2  
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